If using a 2mm thick thermal pad to connect the CPU to the heatsink, does the size of the pad matter? Should it be cut to the size of just the metal piece in the middle of the CPU (10mm x 10mm) or does it need to be sized for the entire CPU (25mm x 25mm) (i.e. including the green bit).
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It would just be for the metal areas.
I highly suggest using thermal paste for capped processors though, it provides better conduction and paste life. This research paper from AMD has good instructions for both methods, as well as advantages and disadvantages. | |||||
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I would personally recommend using thermal paste, two of my favourites are:
Using a small blob smoothen it out with a cut piece of card and make the application a thin layer over the processer lid, there should be just enough that it covers an even film across. Thermal Pads provide a thick layer increasing heat and are only recommended for components like Memory | |||||
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Most of the heat will be coming from the metal section, but I'd cut the pad for the full size of the CPU package. The larger the heat transfer area the more heat you'll get out. | |||
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