I have an Asus Maximus IV Extreme-Z. While installing the standoffs for mounting my waterblock, the pliars slipped and I damaged 3 traces. Scraped it down to the 1st copper layer. The three traces connect the CPU directly to dram bank 1.
Needless to say, the system will not post with DIMMs populated in bank 1 so I am stuck populating my 2 DIMMs in bank 2 causing me to lose dual channel operation and causing extra stress on the IMC, forcing me to lower my RAM speed and loosen timings to maintain stability.
The repair is not a concern. I can seal the copper layer and jump the traces. My question is, by jumping the gap in the traces, the length and materials and therefore the resistance will be (very, very slightly) changed.
Will this have an impact on overall stability?
I know the difference will be minimal but I typically run my ram at 2133MHz at 8-10-8-24 with 1t command rate. At such high speeds I know every little Change in the system can have negative (or positive) effects. If yes, is it something that can be corrected by adjusting clock skew?